專有名詞
| A | Ampere | 安培 (電流單位) |
| ABS | Anti-lock Braking System | 防鎖死煞車系統 |
| ADAS | Advanced Driver Assistance System | 先進駕駛輔助系統 |
| ADC | Analog to Digital Converter | 類比數位轉換器 |
| ADSL | Asymmetric Digital Subscriber Line | 非對稱數位用戶迴路 |
| AEBS | Advanced Emergency Braking System | 緊急剎車輔助系統 |
| AFM | Atomic Force Microscopy | 原子力顯微鏡 |
| AFR | Air Fuel Ratio | 空燃比 |
| AP | Access Point | 無線接入點 |
| APON | ATM Passive Optical Network | ATM無源光網絡 |
| APQP | Advanced Product Quality Planning Control Plan | 先期產品品質規劃和管制計畫 |
| AQL | Accept Quality Level | 允收品質水準 |
| A/S | Assembly | 組立 |
| ASTM | American Society for Testing and Materials | 美國材料試驗協會 |
| ATE | Automatic Test Equipment | 自動測試設備 |
| ATM | Asynchronous Transfer Mode | 非同步傳輸模式 |
| ATS | Automatic Transfer Switch | 自動切換開關 |
| AVB | Audio Video Bridging | 影音橋接 |
| BAS | Brake Assist System | 剎車輔助系統 |
| BAW | Bulk Acoustic Wave | 體聲波 |
| BBU | Battery Backup Unit | 備援電池模組 |
| BCM | Boundary Conduction Mode | 邊界導通模式 |
| BDC | Bottom Dead Center | 下止點 |
| BESS | Battery Energy Storage System | 電池儲能系統 |
| BJT | Bipolar Junction Transistor | 雙載子接面電晶體 |
| BLIL | Bridgeless Interleaved | 無橋交錯 |
| BME | Base Metal Electrode | 卑金屬電極 (MLCC的材料分類) |
| BOSA | Bidirectional Optical Sub-Assembly | 雙向光學組裝件 |
| BPON | Broadband Passive Optical Network | 寬頻被動式光纖網路 |
| BSPDN | Backside Power Delivery Network | 晶背供電網路 |
| BW | Bandwidth | 頻寬 |
| C | Capacitor ( Capacitance) | 電容器 (電容量) |
| C | Coulomb | 庫倫 (電荷單位) (1C=1F x 1V = 1A x 1S) |
| C0G | MLCC EIA Code ClassⅠ Type | MLCC EIA Code ClassⅠ的類別 |
| CAR | Corrective Action Report | 矯正預防措施報告 |
| CCD | Charge-coupled Device | 感光耦合元件 |
| CCL | Copper Clad Laminate | 銅箔基板 |
| CCM | Continuous-Conduction Mode | 連續導通模式 |
| CES | Consumer Electronics Show | 消費性電子展 |
| CIP | Continuous Improvement Plan | 持續改善計畫 |
| CIS | Component Information Systems | 零件資訊系統 |
| CISPR | 法語 Comité International Spécial des Perturbations Radioélectriques | 國際無線電干擾特別委員會 |
| CML | Current Mode Logic | 電流模式邏輯 |
| CMOS | Complementary Metal Oxide Semiconductor | 互補金屬氧化物半導化 |
| CMRR | Common Mode Rejection Ratio | 共模抑制比 |
| CNR | Centra Nonlinear Resistor | 壓敏電阻 (品牌舜全Centra) |
| CNT | Carbon Nanotube | 奈米碳管 |
| CPLD | Complex Programmable Logic Device | 複雜可程式化邏輯元件 |
| CPS | Cyber-Physical System | 網宇實體系統 |
| CSDI | Customer Service Defect Indentification | 客戶、服務、缺陷、識別 |
| CoC | Code of Conduct | 行為準則 |
| CPU | Central Processing Unit | 中央處理器 |
| CrCM | Critical Conduction Mode | 臨界導通模式 |
| CRM | Critical Conduction Mode | 臨界導通模式 |
| CRM | Customer Relationship Management | 客戶關係管理 |
| CRT | Cathode Ray Tube | 陰極射線管的顯示器 |
| CTE | Coefficient of thermal expansion | 膨脹係數 |
| CTR | Critical Temperature Resistance | 臨界溫度熱敏電阻 (或可稱玻璃態熱敏電阻) |
| CTR | Current Transfer Ratio | 電流轉換比 |
| CVD | Chemical Vapor Deposition | 化學氣相沉積法 |
| DAC | Digital to Analog Converter | 數位類比轉換器 |
| DCM | Discontinuous-Conduction Mode | 不連續導通模式 |
| DCN | Design Change Notice | 設計變更通知 |
| DDR SDRAM | Double Data Rate SDRAM (Synchronizes Dynamic Random Access Memory) | 雙倍資料率同步動態隨機存取記憶體 |
| DF | Dissipation Factor | 消耗因子 |
| DFA | Design For Assembly | 裝配性設計 (設計可製組裝) |
| DFC | Design For Cost | 成本性設計 (成本導向設計) |
| DFM | Design For Manufacturing | 製造性設計 (設計可製造性) |
| DFMEA | Design Failure Mode and Effects Analysis | 設計失效模式與效應分析 |
| DFT | Design For Testing | 測試性設計 (設計可測試) |
| DLC | Diamond-Like Carbon | 類鑽石 |
| DMIPS | Dhrystone Million Instructions executed Per Second | 測整數計算能力 |
| DMOS | Double-Diffused MOS | 雙重擴散金氧半場效電晶體 |
| DUT | Device Under Test | 待測物 |
| DOA | Dead On Arrival | 貨到客戶端於合約約定天數內損壞 |
| DOE | Design of Experiment | 試驗設計 |
| DCR | Direct Current Resistance | 直流阻抗 |
| DVS | Dynamic Voltage Scaling | 動態電壓調節 |
| DVT | Design Verification Test | 設計驗證測試 |
| DWG | Drawing | 繪圖、圖面 |
| EAP | Enterprise Access Point | 企業級無線接入點 |
| ECC memory | Error-correcting code memory | 錯誤修正碼記憶體 |
| ECFA | Economic Cooperation Framework Agreement | 兩岸綜合性經濟合作協定或兩岸綜合經濟合作協定（英文譯名：Comprehensive Economic Cooperation Agreement, CECA |
| ECN | Engineering Change Notice | 工程變更通知 |
| ECR | Engineering Change Request | 工程變更需求 |
| ECS | Electronic Control System | 電子控制系統 |
| ECU | Electronic Control Unit | 電子控制單元 |
| ECU | Engine Control Unit | 發動機控制器 |
| EDX | Energy Dispersive X-Ray Fluorescence Spectrometer | 能量分散式X光螢光光譜儀 |
| EEE | Energy-Efficient Ethernet | 高能效乙太網 |
| EFI | Electrical Fuel Injection System | 電子式燃料噴射裝置 |
| EPLD | Electrically Probrammable Logical Device Erasable Probrammable Logical Device | 可擦除程式化邏輯元件 |
| EEPROM | Electrically-Erasable Programmable Read-Only Memory | 電子抹除式可複寫唯讀記憶體 |
| EMC | Electromagnetic Compatibility | 電磁相容 |
| EMF | ElectroMotive Force | 電動勢 |
| EMF | ElectroMagnetic Field | 電磁場 |
| EMI | Electromagnetic Interference | 電磁干擾 |
| EMS | ElectroMagnetic Susceptibility | 電磁耐受 |
| EMS | Electronics Manufacturing Service | 電子製造服務 |
| EMS | Environment Management System | 環境管理系統 |
| EPON | Ethernet Passive Optical Network | 乙太網路 PON |
| ESC | Electronic Stability Control | 車輛穩定性電子式控制系統 |
| ESD | Electrostatic Discharge | 靜電放電 |
| ESL | Equivalent Series Inductance | 串聯等效電感 |
| EGR | Exhaust Gas Recirculation | 廢氣再循環 |
| ESR | Equivalent Series Resistance | 串聯等效電阻 |
| ETC | Electronic Toll Collection | 電子道路收費系統 |
| EuP | E co-Design Requirements for Energy U sing P roducts | 使用能源產品之環境化設計指令 |
| EV | Electric Vehicle | 電動汽車 |
| ErP | Energy-related Products | 耗能相關產品指令 |
| EVM | Error Vector Magnitude | 誤差向量振幅 |
| EVT | Engineering Verifiction Test | 工程驗證測試 |
| F | Farad | 法拉 (電容單位) |
| F | Frequency | 頻率 |
| F/T | Final Test | 終測 |
| FED | Field Emission Display | 場發射顯示器 |
| FEGSEM | Field Emission Gun Scanning Electron Microscopy | 場發射掃描式電子顯微鏡 |
| FAR | Failure Analysis Report | 不良分析報告 |
| FMEA | Failure Mode & Effect Analysis | 失效模式與效應分析 |
| FPGA | Field-Programmable Gate Array | 現場可程式化閘陣列 |
| GP | 一般為 Sony Green partner簡稱GP | 此處說明為Green product 或Environmental Friendly Product |
| GPIO | General Purpose Input/Output | Gigabit (高速) 被動式光纖網路 |
| GPON | Gigabit capable Passive Optical Network | 通用型之輸入輸出 |
| GR&R | Gauge Repeatability and Reproducibility | 重覆性與再現性 |
| GTC | GPU Technology Conference | GPU技術大會 |
| GUI | Graphical User Interface | 圖形使用者介面 |
| HALT | Highly Acceleration Life Test | 高加速壽命測試 |
| HBM | High Bandwidth Memory | 高頻寬記憶體 |
| HDL | Hardware Description Language | 硬體描述語言 |
| HEV | Hybrid Electric Vehicle | 混合動力汽車 |
| HMI | Human Machine Interface | 人機介面 |
| HRTEM | High Resolution Transmission Electron Microscopy | 高解析度穿透式電子顯微鏡 |
| HS | Hazardous Substance | 危害物質 |
| HSF | Hazardous Substance Free | 無危害物質 |
| I | Current | 電流 (I = V/R = P/V) |
| I/N | Manual Insertion | 手插件 |
| I2C Bus | Inter-Integrated Circuit Bus | 積體電路匯流排 |
| IBA | Intermediate Bus Architecture | 中間匯流排架構 |
| IBC | Intermediate Bus Converter | 中間匯流排轉換器 |
| IBIS | Input / Output Buffer Information Specification | 輸入輸出緩衝器資訊規範 |
| IBP | Initial Business Plan | 初步的商業計劃書 |
| ICE | In Circuit Emulator | 電路內部仿真器 |
| ICL | Inrush Current Limit | 限制浪湧電流 |
| ICT | In-Circuit Testing | 線上測試 |
| IDM | Integrated Device Manufacturer | 整合元件製造商 |
| IDT | InterDigital Transducer | 交指叉轉換器 |
| IEC | International Electrotechnical Commission | 國際電氣委員會/國際電工協會 |
| IEEE | Institute of Electrical and Electric Engineers | 電機電子工程學會 |
| IGBT | Insulated Gate Bipolar Transistor | 絕緣柵雙極電晶體 |
| IL | Insertion Loss | 插入損失 |
| IR | Insulation Resistance | 絕緣阻抗 |
| IR | Infrared Ray | 紅外線 |
| IoT | Internet of Things | 物聯網 |
| ISMS | Information Security Management System | 資訊安全管理系統 |
| ISO | International Organization for Standardization | 國際標準組織 |
| JEDEC | Joint Electron Device Engineering Council | 聯合電子管工程委員會 |
| k | Thermal Conductivity | 導熱系數 |
| L | Inductor 縮寫 | 電感縮寫 |
| LAN | Local Area Network | 區域網路 |
| LC | Leakage Current | 漏電流 |
| LCD | Liquid Crystal Display | 液晶顯示器 |
| LDO Regulator | Low Drop-Out regulator | 低壓降線性電源轉換 |
| LDS | Loading sketch drawing | 零件位置圖 |
| LDMOS | Laterally Diffused Metal Oxide Semiconductor | 橫向擴散金屬氧化物半導體 |
| LDWS | Lane Departure Warning System | 車道偏離警示系統 |
| LED | Light-Emiting Doide | 發光二極體 |
| LHPZ | Left Half-Plane Zero | 左半邊零點 |
| LOI | Letter Of Intent | 合作意願書 |
| LPD | Lateral Power Delivery | 橫向供電 |
| LTB | Last Time Buy | 最終採購 |
| LVCMOS | Low Voltage Complementary Metal Oxide Semiconductor | 低壓互補金屬氧化物半導化 |
| LVDS | Low Voltage Differential Signal | 低壓差動訊號 |
| LVPECL | Low Voltage Positive Emitter-Coupled Logic | 低電壓正發射極耦合邏輯 |
| M2M | Machine-to-Machine | 機器對機器 |
| MAC | Media Access Control | 媒介存取控制層 |
| MCM | Modular Current Multiplier | 模組化電流倍增器 |
| MBT | Minimum Spark Advance for the Best Torque | 最佳扭力點火提前角 |
| MDA | Manufacture Defect Analyzer | 製造缺陷分析系統 |
| MDC | Management Data Clock | 管理數據時間 |
| MDIO | Management Data Input/Output | 管理數據輸入/輸出 |
| MEMS | Micro electromechanical system | 微機電系統 |
| MLCC | Mult-Layer Ceramic Capacitor | 積層陶瓷電容 |
| MLPC | Multi-Layer Polymer Capacitor | 疊層固態電容 |
| MOSFET | Metal-Oxide Semiconductor Field-Effect-Transistor | 金氧半場效電晶體 |
| MOU | Memorandum Of Understanding | 備忘錄 |
| MOV | Metal Oxide Varistor | 金屬氧化物壓敏電阻 |
| MOQ | Minimum Order Quantity | 最少訂單數量 |
| MP | Mass Production | 量產 |
| MPS | Master Production Schedule | 主生產計劃 |
| MRB | Material Review Board | 材料審查會議 |
| MRP | Material Requirement Planing | 原料需求計劃 |
| MSDS | Material Safety Data Sheet | 物質安全資料表 |
| M.T.B.F | Mean Time Between Failure | 平均故障間隔時間 |
| MWCNT | Multi-Walled Carbon NanoTube | 多壁奈米碳管 |
| NDA | Non-Disclosure Agreement | 保密協議 |
| NEBS | Network Equipment-Building System | 網絡設備構建系統 |
| NME | Noble Metal Electrode | 貴金屬電極 (MLCC的材料分類) |
| NPO | Negative Positive Zero | MLCC EIA Code ClassⅠ的類別 |
| NRE | Non-Recurring Engineering Expense | 一次性工程費用 |
| NTC | Negative Temperature Coefficient | 負溫度係數 |
| NVRAM | Non-Volatile Random Access Memory | 非揮發性隨機存取記憶體 |
| OAP | Outdoor Access Point | 戶外無線接入點 |
| OCL | Open Circuit Inductance | 開路電感量 |
| OCP | Over Current Protection | 過電流保護 |
| OCXO | Oven Controlled Crystal Oscillator | 恆溫晶體振盪器 |
| ODM | Original Design Manufacturer | 客戶設計委託生產 |
| OELD | Organic ElectroLuminescence Display | 有機電激發光顯示器 |
| OEM | Original Equipment Manufacturer | 客戶設計委託生產 |
| OM | Optical Microscopy | 光學顯微鏡 |
| OSC | Oscillator | 振盪器 |
| OSAT | Outsourced Semiconductor Assembly and Test | 封測代工 |
| OTP | Over Temperature Protection | 過溫度保護 |
| OVP | Over Voltage Protection | 過電壓保護 |
| P | Power | 功率 (P=V * I =I2R) |
| PC | Polycarbonate | 聚碳酸酯 |
| PCB | Printed Circuit Board | 印刷電路板 |
| PCBA | Printed Circuit Board Assembly | 印刷電路板總成 |
| PCI | peripheral component interconnect | 周邊零件連接 |
| PCIe | Peripheral Component Interconnect Express | 高速週邊元件互連 |
| PCIe CEM | Peripheral Component Interconnect Express | PCIe 卡機電規範 |
| PCN | Card Electromechanical | 零件變更通知 |
| PCXO | Programmable Crystal Oscillator | 可程式化晶體振盪器 |
| PDD | Product Description Document | 產品說明文檔 |
| PDN | Power Distribution Network | 電源分佈網路 |
| PDP | Plasma Display Panel | 電漿顯示器 |
| PE | Polyethylene | 聚乙烯 |
| PECL | Positive Emitter-Coupled Logic | 正發射極耦合邏輯 |
| PET | Polyester | 聚酯 |
| PFM | Pulse Frequency Modulation | 脈沖頻率調變 |
| PHEV | Plug-in Hybrid Electric Vehicle | 插電式油電混合車 |
| PHY | Physical layer Device | 實體層 |
| P/K | Packing | 包裝 |
| PI | Polyimide | 聚醯亞胺 |
| PLL | Phase-Locked Loop | 鎖相迴路 |
| PFMEA | Process Failure Mode and Effects Analysis | 過程失效模式與效應分析 |
| PoC | Power Over Coaxia | 同軸電纜供電 |
| PoE | Power Over Ethernet | 乙太網路供電 |
| POR | Power On Reset | 開機重制 |
| PP | Prepreg | 預浸料/半固化片 |
| PP | Polypropylene | 聚丙烯 |
| PPAP | Productlon Part Approval Process | 生產件批准程序 |
| ppm | Parts Per Million | 百萬分之一 |
| PPS | Polyphenylene Sulfide | 聚苯硫醚 |
| PS | Polystyrene | 聚苯乙烯 |
| PSU | Polysulfone | (PSU、PSF) 聚碸 |
| PSU | Power Supply Unit | 電源供應單元 (可簡稱為電源供應器) |
| P/T | Preliminary Test | 初測 |
| PTC | Positive Temperature Coefficient | 正溫度係數 |
| PTFE | Polytetrafluoroethylene | 聚四氟乙烯 |
| PWM | Pulse Width Modulation | 脈衝寬度調變 |
| QMS | Quality Management System | 質量管理體系 |
| QVL | Qualified Vendor List | 合格供應商名冊 |
| QoS | Quality of Service | 服務品質 |
| R | Resistor (Resistance) | 電阻 (電阻值) (R = V/I) |
| RFI | Radio Frequency Interence | 射頻干擾 |
| RFIC | Radio Frequency Integrated Circuit | 射頻積體電路 |
| RFID | Radio Frequency Identification | 無線射頻辨識 |
| RFQ | Request For Quotation | 詢(報)價單 |
| RHPZ | Right-Half-Plane Zero | 右半邊零點 |
| RMA | Return Material Authorizations | 退貨授權 |
| RL | Return Loss | 反射損失 |
| RMS | Root Mean Square | 均方根值 |
| RoHS | the R estriction O f the use of certain H azardous S ubstancesin electrical and electronic equipment) | 電子及電器設備禁用物質指令 |
| ROI | Return On Investment | 投資回報率 |
| ROSA | Receiver Optical Sub-Assembly | 光接收次組裝模組 |
| RTOS | Real-Time Operating System | 即時作業系統 |
| rPDU | Rack Power Distribution Unit | 機櫃式電源分配器 |
| RPN | Risk Priority Number | 風險順序數 |
| RPP | Remote Power Pane | 遠端電源盤 |
| RPS | Redundant Power Supply | 冗餘 (備用) 電源 |
| RTC | Real Time Clock | 實時時鐘 |
| SAW | Surface Acoustic Wave | 表面聲波 |
| SDRAM | Synchronous Dynamic Random Access Memor | 同步動態隨機存取記憶體 |
| SELV | Safety Extra Low Voltage | 安全低電壓 |
| SEM | Scanning Electron Microscopy | 掃描式電子顯微鏡 |
| SEPIC | Single Ended Primary Inductance Converter | 單端初級電感轉換器 |
| SESUB | Semiconductor Embedded in SUBstrate | 半導體內嵌基板 |
| SGMII | Serial Giga Media Independent Interface | 串列Giga介質無關介面 |
| SG | Smart Grid | 智慧電網 |
| SI | Signal Integrity | 訊號完整度 |
| SiP | System in Package | 系統級封裝 |
| SMD | Surface Mount Device | 表面黏著元件 |
| SMPS | Switching Mode Power Supply | 切換式電源供應器 |
| SMT | Surface Mount Technology | 表面黏著技術 |
| SMI | Serial Management Interface | 串列管理介面 |
| SFP | SSmall Form-factor Pluggables | 小型熱插拔 |
| SoC | System on Chip | 系統單晶片 |
| SOP | Standard Operatiion Procedure | 標準作業指導書 |
| SOW | Statement for Work | 工作說明書 |
| SPS | Source Power Supply | (主要)電源供應器 |
| SPXO | Simple Packaged Crystal Oscillator | 簡單封裝晶體振盪器 |
| SSC | Spread Spectrum Clock | 展頻時脈 |
| SWCNT | Single-Walled Carbon NanoTube | 單壁奈米碳管 |
| T/U | Touch up | solder 補焊 |
| TCM | Transition Conduction Mode | 轉換導通模式 |
| TDC | Top Dead Center | 上止點 |
| TDR | Time Domain Reflectometry | 時間區域反射法 |
| TEM | Transmission Electron Microscopy | 穿透式電子顯微鏡 |
| THD | Total Harmonic Distortion | 總諧波失真 |
| THT | Through Hole Technology | 穿孔插件技術 |
| TIE | Time Interval Error | 時間間隔誤差 |
| TNR | Toshiba Non-linear Resistor | 東芝公司的非線性電阻 (壓敏電阻的一種) |
| TNV | Telecommunication Network Voltage | 電信網電壓 |
| TRD | Test Requirement Document | 測試需求文檔 |
| TOSA | Transmitter Optical Sub-Assembly | 光接發射組裝模組 |
| TPMS | Tire Pressure Monitoring System | 胎壓偵測系統 |
| TQM | Total Quality Management | 全面質量管理 |
| UART | Universal Asynchronous receiver Transmitter | 通用非同步收發傳輸器 |
| UPS | Uninterruptible Power Supply | 不間斷電源系統 |
| USB | Universal Serial Bus | 萬用串列匯流排 |
| UTP | Unshielded Twisted Pair | 非屏蔽雙絞線 |
| V | Volt | 福特 (電壓單位) |
| V | Voltage | 電壓 (V = I x R = P/I) |
| V2H | Vehicle To Home | 電動車向住家放電 |
| Varistor | Variable（會變的）+ Resistor（電阻） | 壓敏電阻 |
| VCSO | Voltage Controlled SAW Oscillator | 壓控表面波聲體振盪器 |
| VCT System | Variable Cam Timing System | 可變凸輪軸正時系統 = VVT System |
| VCTCXO | Voltage Controlled/ Temperature Compensated Crystal Oscillator | 壓控溫度補償晶體振盪器 |
| VCXO | Voltage Controlled Crystal Oscillator | 壓控晶體振盪器 |
| VDR | Voltage Dependent Resistor | 壓敏電阻 |
| VDSL | Very-high-bit-rate Digital Subscriber Line | 超高速數位用戶迴路 |
| VHDL | VHSIC（Very High Speed Integrated Circuit）Hardware Description Language | 超高速積體電路硬件描述语言 |
| VPD | Vertical Power Delivery | 垂直供电 |
| VSCC | Vehicle Safety Certification Center | 車輛安全審驗中心 |
| VTM | Voltage Transformation Module | 直流變壓模組 |
| VVT System | Variable Valve Timing System | 可變氣門正時系統 = VCT System |
| W | Watt | 瓦特 (功率單位) = 1焦耳/秒 |
| WAN | Wide Area Network | 寬域網路 |
| WDT | Watch Dog Timer | 看門狗 (監視時間器) |
| WEEE | Waste Electrical and Electronic Equipment | 電子及電器設備廢棄物處理指令 |
| Wi-Fi | Wireless Fidelity | 無線聯網的技術 |
| WiMAX | Worldwide Interoperability for Microwave Access | 全球互通微波存取 |
| WOL/WoL | Wake-on-LAN | 網路喚醒 / 遠端喚醒 |
| WSN | Wireless Sensor Network | 無線傳感器網絡 |
| X5R | MLCC EIA Code Class Ⅱ Type | MLCC EIA Code Class Ⅱ的類別 |
| X6S | MLCC EIA Code Class Ⅱ Type | MLCC EIA Code Class Ⅱ的類別 |
| X7R | MLCC EIA Code Class Ⅱ Type | MLCC EIA Code Class Ⅱ的類別 |
| X8R | MLCC EIA Code Class Ⅱ Type | MLCC EIA Code Class Ⅱ的類別 |
| X'tal | Crystal | 石英晶體 |
| xDSL | X-Digital Subscriber Line | x 數位用戶迴路 |
| XO | Crystal Oscillator | 石英振盪器 |
| XUAI | 10Gigabit Attachment Unit Interface | 10千兆位連接單元接 |
| Y5V | MLCC EIA Code Class ⅡType | MLCC EIA Code ClassⅠ的類別 |
| Z | Impedance | 阻抗 (Ω) |
| Z5U | MLCC EIA Code Class ⅡType | MLCC EIA Code ClassⅠ的類別 |
| ZCD | Zero Current Detector | 零電流偵測 |
| ZCD | Zero Crossing Detection | 零交越偵測 |
| ZFLOPS | Zetta Floating-point operations per second | 每秒十萬億億次（10^21浮點運算) |
| ZNR | Zinc-Oxide Non-linear Resistor | 氧化鋅非線性電阻 (壓敏電阻的類別) |
| ZOV | Zinc-Oxide Varistor | 氧化鋅壓敏電阻 |